[ad#review997-top]Today we got a chance to check out the Thermaltake ISGC-300, the third of four Thermaltake ISGC CPU Coolers. Its tall, yet narrow design allows for plenty of airflow and an easy of installation. Supporting the latest CPU’s, the ISGC-300 provides a powerful cooling method which can be easily adjusted between low and high speed settings. Read on further to see how well it performed in comparison with the ISGC-100 and ISGC-200.
Features
Innovative Silent Fan with Advanced Technology
– Unique ISGC Fan Blade
– Hydro Dynamic Bearing (HDB)
The Ultimate Copper+ Base Architecture x 4 Heatpipes
Individual 33 Sawtooth Tower Fins
Support multi-socket mounting system for LGA1366, LGA775, AM2, AM2+
Specifications
Heatsink Dimension: 126(L) x 71(W) x 161(H) mm, 4.96(L) x 2.8″(W) x 6.34(H) in
Heatsink Material: Aluminum Fins, Aluminum Extrusion Cover + Copper Base
Heatpipe: 6 mm x 4
Fan Dimension: 120 x 25 mm
Fan Speed: 800 ~ 1300 RPM
Bearing Type: Hydro Dynamic
Noise Level: 16 dBA
Max. Air Flow: 58.3 CFM
Max. Air Pressure: 1.4 mmH2O
Power Connector: 3 Pins
Rated Voltage: 12 V
Started Voltage: 7 V
MTBF: 50,000 Hours
Weight: 697 g
Packaging
The Thermaltake ISGC-300 follows the same pattern of packaging as the ISGC-100 and ISGC-200. An image of the cooler sits below the ISGC-300 name, above the ISGC acronym explanation and features and to the left of Zoe, Goddess of Victory. The sides go into the more detailed specifications and features while the back covers some of the core components of the ISGC Fan.
The cooler is nicely packed inside the cardboard box. Trying to get it, as well as the parts, can be somewhat annoying; the box unfolds on itself. Hiding inside the box are all the components needed for installation.
[ad#review997-bottom]