“Vapour chambers and heatpipes work on the same principle, the difference is that vapour chambers are planar thermal devices that conduct heat in two dimensions. The two 19x3mm vapour chambers on the Coolermaster TPC-812 heatsink are double-stacked (one vapour chamber on top of three heatpipes), much like the Xigmatek Aegir. Since vapour chambers are planar devices this represents a more efficient application that piling tubular heatpipes on top of tubular heatpipes. Coolermaster’s TPC-812 is the first CPU heatsink to pass our test bench employing both vapour chambers and heatpipes in one package.”
Via FrostyTech