Intel is planning to drop their “Atom” brand name. The main reason behind this is because many people associate it with “entry-level” or “cheap”. I guess that what Intel gets for the whole netbook idea (remember those?). The Atom branding could affect the popularity of Intel’s “Clover Trail+” mobile SoCs. These mobile SoCs are intended to compete with high performance SoCs from Qualcomm and NVIDIA.
Benchmarks of Intel’s upcoming Ivy Bridge-E socket 2011 flagship processor, the Core i7-4960X have surfaced over at Tom’s Hardware. They have already scored an engineering sample of the new chip and have run it through quite a few different benchmarks as well as comparing it to previous Intel generations and AMD’s current generation of chips. These include the i7-3970X, i7-4770K, i7-3770K, i7-2700K, FX-8350, and A10-5800K.
In spite of the fact that Haswell that is considered to be Intel’s latest consumer platform; Intel is still seeking to keep Ivy Bridge and LGA 1155 intact with some more CPU releases. Intel plans to release four new CPUs in the near future which include two Core i5 and two Celeron models.
Intel’s Haswell –X Xeon EP processor has come to the light in Penang, Malaysia (Intel’s facility) during the company’s “Design in Asia” tour. This Haswell –X Xeon EP processor got revealed in a visit from VR-Zone’s Nebojsa Novakovic. The processor seems to be the Socket 2011-3 Haswell EP or Xeon E5 v3, presenting 14 cores, a 35 MB cache; twin 9.6 GT/s QPI channels and also supports quad channel DDR4-2133 memory.
Intel HTS1155LP active thermal solution has been designed for ultra-thin desktops and is not only compatible with Intel’s own DH61AG mainboard but also with thin mini-ITX H6x-based mainboards from other dealers. The system depends on comparatively small heatsink (weighs 264 grams), three pipes and a blower which has 1180 – 3380 rpm fan speed. For controlling the speed by firmware, the blower comes with 4-pin connector.
Intel’s first processor in the BGA package is expected to arrive by the end of this year, according to one of the leaked roadmap slides. Among the first few processors will cover across entry-level market sector, including the Celeron and Pentium brands. Motherboards with BGA processors come with the processors that cannot be the replaced and are hard-wired to the board along with a stock fan-heatsink. The SOC completely put together the processor as far as we know it, with the motherboard chipset.
We went over many of the features that will be coming to Intel’s Skylake platform yesterday. Most notably dual channel DDR4, PCI Express 4.0, SATA Express and AVX 3.2 instructions. Many people anticipated that Skylake would be a SoC (System-on-Chip) design, but the leaked slides from VR-Zone confirm that it will not be a SoC design. Just like Haswell the PCH will still be fused to the motherboard.
It has been reported by VR-Zone that Intel is preparing their new line of SSD 530 Series solid state drives that will feature the latest M.2 interface with NGFF (Next Generation Form Factor). This line will succeed Intel’s SSD 520 and SSD 525 series. According to the leaked roadmap the series should have debuted back in June, but it has been postponed till next week.
We have already detailed Intel’s Haswell-E high-end desktop platform and we know that it will feature quad channel DDR4 memory in the second half of 2014, but what about Intel’s mainstream offerings? We have heard from reports that Intel will refresh the Haswell platform in the second half of 2014, but the Broadwell micro architecture would be limited to Xeon and mobility parts. Only in 2015 will we first see a mainstream 115* 14nm Skylake processor, which will pack some interesting features.
Intel will now be headed by a new CEO who aims to make new strategic plans for the company. Brian Krzanich, who took over as a chief executive in May, believes that Intel has a great user interface and the fact that its compression-decompression technology is outstanding. He mentioned during an interview with Reuters at Intel headquarters that he is thinking about to accelerate the roll-out of chips for smart phones, tablets and wearable devices as consumers take a leap away from personal computers.