PC Watch went ahead and got under the hood of a Core i7-6700K processor, commonly known as de-lidding. What they found was an unexpectedly small silicon, which is actually shorter in proportion to its width than previous dies found on Intel Haswell-D and Ivy Bridge-D and even Intel’s i7-5775C Broadwell processor, which has the same 14 nm process.
Intel’s Ivy Bridge had issues coping with the heat problem which may have been occurred because of the low quality thermal paste under the IHS (integrated Heat spreader). It was actually tested on a 4.5 GHz over clocked i5 3570K and results showed that using a better quality of thermal paste brought a difference of 8 degrees which was used for temperature reduction purpose. If the step taken by Toppc of Coolaler.com is to be believed then Ivy Bridge-E for X79, LGA 2011 will not have to go through the same problem as it has chosen to use much stronger and stable solder, the one Sandy Bridge has got.