DRAM and NAND flash giant SK Hynix will be ready to ship its 4GB stacked second generation high bandwidth memory (HBM2) by Q3 of this year. These HBM2 packages will be made up of four 1GB dies, with a bandwidth-per-pin of 1 Gbps, 1.6 Gbps, and 2 Gbps, working out to per-stack bandwidths of 128 GB/s, 204 GB/s, and 256 GB/s, respectively.
These chips will be targeted at graphics cards, network infrastructure, HPC, and servers. SK Hynix is also working on 8GB stacks, which will be made up of 1GB dies. These stacks will be targeted at high-end HPC and server applications. The company also has cost-effective 2GB 2-die stacks, for graphics cards. This 2GB, 2-die stack could be very important as competition against GDDR5X, especially in mid-range and performance segment graphics cards.