2014 is going to be a busy year for Intel. They have many different product lines scheduled to launch and one of them is their Haswell-E platform. VR-Zone has posted a photo of the first Haswell-E engineering sample. This engineering sample features 8 cores and a 3 GHz clock speed.
Intel’s next gen processor which was based on the 14nm fabrication process has finally been seen now. And Broadwell will be benefiting the notebook/laptop platform and this most typically picks up the most from any progressions in the productivity and efficiency of the TDP.
As expected Intel is planning to launch their Haswell refresh processor lineup in Q2 of 2014. Nothing really new is being added to the architecture except clock speed improvements. VR-Zone has revealed the full Core i7 Haswell refresh lineup and starts with the Core i7-4790 leading the way.
Intel is on its way to roll out their latest 15 core Xeon E7 Ivy Bridge processor which has been designed exclusively for the high-end servers. This new processor by Intel will add up to the Intel’s Ivy Bridge-EX range which includes the flagship Xeon E7-8800 processor with 15 cores and 30 threads.
A handful of slides have been leaked giving us quite a lot of information about Intel’s upcoming solid state drive solutions for 2014. In the second quarter of 2014 we will see the introduction of three storage solutions from Intel, the SSD Pro 2500 series (codename Temple Star), SSD DC P3500 Series (Pleasantdale), and the SSD DC P3700 Series (Fultondale).
This is exactly what Intel is trying to do with its new decision to no longer carry on with the production of the the 2.7 GHz Core i7-3820QM and 2.6 GHz i7-3720QM. It has finally been confirmed officially that Intel is going to discontinue these two quad-core Ivy Bridge mobile processors.
It has been said that the two new SSDs from Intel, the “Fultondale” and “Pleasantdale”, will be dealing with these issues of heat and power. Some documents have been leaked from the company which gives an idea of what the readied version of the data center SSDs is going to look like.
Intel is planning a lot to keep their Thunderbolt technology competitive against USB in 2014. VR-Zone has obtained documents that show that Intel is planning to bring features that are found in USB and Ethernet to the Thunderbolt platform. These new features include the ability to charge devices and transfer files between computers using a straight connection.
Intel’s Xeon Phi Coprocessor has made quite a name for itself in the High Performance Computing sector. This is because while many supercomputers use GPGPUS (General Purpose GPUs) such as NVIDIA Tesla which rely on a CPU and special code to operate the Xeon Phi requires neither. We have just received details of the next generation of the Xeon Phi, which is codenamed “Knights Landing”.
Rumors have it that the Intel Xeon Phi is finally walking out on the PCI-E and is soon going to be available with the usual LGA Socket Packaging. The coprocessor has been built around the MIC (Many Integrated Core) Architecture and can house 60 cores in a single package. These processors which have been used in the HPC and Supercomputing clusters in the GPU form factor, which had plenty of benefits to offer, will now be available with the LGA Socket.