As we get closer to the middle of the year many details about Intel’s upcoming Skylake microarchitecture are becoming clear. Today we have details on the upcoming Core i5-6600K and Core i7-6700K processors.
It looks like Intel will only be launching two socketed LGA1150 Broadwell parts in June. Typically we see a full refresh, but this is not the case with Broadwell. It could be because Intel has large Core Haswell inventories that they still need to get rid of, that Broadwell could be to short of a stopgap between Haswell and Skylake, or BGA chips becoming more commonplace.
In order to help people understand the level of processor performance and make an informed purchase decision based on their needs, Intel Atom processors will now be offered in three distinct brand levels in a good/better/best construct – the Intel Atom x3, x5 and x7 processors. This change will start with the next generation of processors. Intel Atom x3 processor provides basic, but genuine Intel-level tablet, phablet and smartphone performance.
In Intel’s latest Q4 earnings report they have confirmed that Skylake will land in the second half of 2015, but 10 nm is still a far ways off. Intel’s CEO Brian Krzanich has confirmed that the Broadwell delay has not affected the Skylake launch schedule. Intel still plans to release Skylake in the second half of this year around back to school time.
In our previous post we talked about NVIDIA working with TSMC on the 16 nm FinFET process. We wondered why AMD is was not the released list of companies who are working with TSMC. Well it looks like AMD will manufacture their GPUs at Global Foundries.
It looks like TSMC is ready to move to volume production on their 16 nm FinFET process. Based on a recent report we know that NVIDIA is joining them. Does that mean that NVIDIA is skipping the 20 nm fab process completely?
Intel has started to talk about the first details of their next-generation high-end desktop (HEDT) processors codenamed “Braodwell-E”. These Core i7 HEDT processors will be built in the existing LGA2011-3 package and will be compatible with current X99 motherboards (likely with a BIOS update).
We have been hearing rumors about Intel’s Skylake for a while now, but we now have something better than the rumors, an actual photograph of the chip. The below photograph is of a sample that has been sent out to motherboard manufacturers for testing.
We have been hearing many different rumors on Haswell-E pricing, but VideoCardz has revealed the pricing for Intel’s next-generation HEDT (high-end desktop) processors in leaked press slides that they have obtained.
Intel’s 4th Generation Core i7 HEDT (high-end desktop) processors codenamed “Haswell-E” along with the accompanying X99 chipset will be launched at the end of this week. With this launch we will see a whole slew of new motherboards and since this will be the first consumer platform to support DDR4 we will see many new DDR4 modules as well. Today we will be going over what we know about the upcoming processors, X99 chipset, new motherboards and DDR4 memory. If you are interested in the upcoming HEDT platform then this article should give you all of the information that you need.
Oct 13, 2015 0
Oct 13, 2015 0
Oct 05, 2015 0