Intel’s next unit of computing (NUC) is actually a tiny computer that highlights Intel’s ability to make small, interesting and useful form factors. It comes in two models; one is specifically catering the business applications while other is inclined towards consumers for general usage purpose. You will be surprised to hear the news which might not have come in anyone’s knowledge but for your information, Intel’s next unit of computing mini PC has a flaw, and the defect is; it does not cool the mPCIe card very well. The problem arises when the system gets too overloaded; the mini PCI express WLAN card can over heat which results in the mal-functioning of the mSATA SSD next to it.
Actually Intel’s revised 8-series chipsets were supposed to be available to motherboard OEMs as soon as this month turned up. According to a few sources, this won’t happen since chipset is just not ready. Intel Corporation has passed a statement to confirm the USB 3.0 interface on its Haswell processor supporting a chipset design defect. A portable drive disappeared phenomenon will appear in the system into standby. On the other hand, USB 3.0 ports stop working after entering or leaving windows sleep mode.
If reports leaked over the internet are true than most probably Intel’s’ next generation Bay trail platform will have some extra ordinary performances. Intel upcoming Atom Z3770 processors allow power quad core chip that will include in the Bay Trail family. It uses the company’s Silvermont technology which is expected to power the upcoming Atom, Celeron and Pentium chips. Benchmark results were recently shown on one of the websites which gave us a clear picture of what kind of performance to expect and highlights on the fact that how the new Atom Z3770 is compared with other processors and its forerunners.
Intel is planning to drop their “Atom” brand name. The main reason behind this is because many people associate it with “entry-level” or “cheap”. I guess that what Intel gets for the whole netbook idea (remember those?). The Atom branding could affect the popularity of Intel’s “Clover Trail+” mobile SoCs. These mobile SoCs are intended to compete with high performance SoCs from Qualcomm and NVIDIA.
Benchmarks of Intel’s upcoming Ivy Bridge-E socket 2011 flagship processor, the Core i7-4960X have surfaced over at Tom’s Hardware. They have already scored an engineering sample of the new chip and have run it through quite a few different benchmarks as well as comparing it to previous Intel generations and AMD’s current generation of chips. These include the i7-3970X, i7-4770K, i7-3770K, i7-2700K, FX-8350, and A10-5800K.
In spite of the fact that Haswell that is considered to be Intel’s latest consumer platform; Intel is still seeking to keep Ivy Bridge and LGA 1155 intact with some more CPU releases. Intel plans to release four new CPUs in the near future which include two Core i5 and two Celeron models.
Intel’s Haswell –X Xeon EP processor has come to the light in Penang, Malaysia (Intel’s facility) during the company’s “Design in Asia” tour. This Haswell –X Xeon EP processor got revealed in a visit from VR-Zone’s Nebojsa Novakovic. The processor seems to be the Socket 2011-3 Haswell EP or Xeon E5 v3, presenting 14 cores, a 35 MB cache; twin 9.6 GT/s QPI channels and also supports quad channel DDR4-2133 memory.
Intel HTS1155LP active thermal solution has been designed for ultra-thin desktops and is not only compatible with Intel’s own DH61AG mainboard but also with thin mini-ITX H6x-based mainboards from other dealers. The system depends on comparatively small heatsink (weighs 264 grams), three pipes and a blower which has 1180 – 3380 rpm fan speed. For controlling the speed by firmware, the blower comes with 4-pin connector.
Intel’s first processor in the BGA package is expected to arrive by the end of this year, according to one of the leaked roadmap slides. Among the first few processors will cover across entry-level market sector, including the Celeron and Pentium brands. Motherboards with BGA processors come with the processors that cannot be the replaced and are hard-wired to the board along with a stock fan-heatsink. The SOC completely put together the processor as far as we know it, with the motherboard chipset.
We went over many of the features that will be coming to Intel’s Skylake platform yesterday. Most notably dual channel DDR4, PCI Express 4.0, SATA Express and AVX 3.2 instructions. Many people anticipated that Skylake would be a SoC (System-on-Chip) design, but the leaked slides from VR-Zone confirm that it will not be a SoC design. Just like Haswell the PCH will still be fused to the motherboard.