Intel’s Ivy Bridge had issues coping with the heat problem which may have been occurred because of the low quality thermal paste under the IHS (integrated Heat spreader). It was actually tested on a 4.5 GHz over clocked i5 3570K and results showed that using a better quality of thermal paste brought a difference of 8 degrees which was used for temperature reduction purpose. If the step taken by Toppc of Coolaler.com is to be believed then Ivy Bridge-E for X79, LGA 2011 will not have to go through the same problem as it has chosen to use much stronger and stable solder, the one Sandy Bridge has got.
Toppc of Coolaler.com managed to achieve an engineering sample of Intel’s upcoming Core i7-4960X (Ivy Bridge-E) socket LGA 2011 processor and without wasting time took a little sneak peek inside its IHS which was soldered down with thermal paste around the edges.
Toppc discovered that Intel is using a strong solder to fuse the processor’s die to IHS and not the non-conductive thermal paste. Solders tend to have better heat conductivity than pastes and are very hard to get off thus making it difficult to de-lid the processors. In the entire process of de-lidding the chip, it apparently seems that Toppc has sedated a couple of components around the die. In any case, consumers will find that they simply do not need to take the IHS off because Intel has opted for solder.
Source: eTeknix via Coolaler.com | News Archive