Asetek Inc., the world’s leading supplier of liquid cooling solutions for computers announced today that it will show direct-to-chip liquid cooling systems for Intel Xeon Phi Coprocessors at SC12.
Asetek direct-to-chip technology captures heat from the hot spots in servers notably CPUs, coprocessors and memory directly into liquid. Once the heat is in the liquid it is easily transported to a suitable point for rejection. Suitable heat rejection points range from within a server’s normal cooling air stream using Asetek Internal Loop Liquid Coolers to completely outside of the data center building using hot water and Asetek RackCDU™ liquid cooling. Rejecting heat at the right point increases cooling efficiency which delivers density benefits and savings in energy costs at the server and in data center cooling.
“Asetek direct-to-chip liquid cooling focuses on removing heat from the hottest locations in servers and Intel Xeon Phi coprocessors are key hot spots in a growing number of high performance servers,” said André Sloth Eriksen, Founder and CEO of Asetek. “Cooling coprocessors is important to our strategy of ‘cooling what’s hot’ in a server to maximize the gains in density and energy efficiency in an affordable manner.”
Asetek’s range of liquid cooling solutions gives data center managers more flexibility to optimize the thermal, power, and performance of their operations. Asetek will display its liquid cooling solution for Intel Xeon Phi coprocessors at SC12 in booth #4045. The booth will also include a full display of Asetek’s groundbreaking hot-water, direct-to-chip RackCDU liquid cooling systems. SC12 is being held in Salt Lake City, Utah – November 12-15.